HFM-706-LAMBDA-MEDIUM

NETZSCH Group (Erich NETZSCH B.V. & Co. Holding KG) -- Pumps & Systems: NETZSCH Pumpen & Systeme GmbH; Grinding & Dispersing: NETZSCH-Feinmahltechnik GmbH; Analyzing & Testing: NETZSCH-Gerätebau GmbH HFM-706-LAMBDA-MEDIUM

HFM 706 Lambda Medium

Технические характеристики

StandardsASTM C518, ISO 8301, JIS A1412, DIN EN 12667, DIN EN 12664
TypeBench-top device
Thermal conductivity range0.002 to 2 W/(m·K)** Small and Medium : 2.0 W/(m·K) achievable with optional instrumentation kit, recommended for hard materials and those with higher thermal conductivity Performance data: Accuracy: ± 1% to 2% Repeatability: ± 0.25% Reproducibility: ± 0.5% → All performance data is verified with NIST SRM 1450 D (thickness 25 mm)
Plate temperature range-20°C to 90°C, optional:  -30° to 90°C
Air-tight systemSample compartment with possibility to introduce purge gas
Metering area heat flux transducer102 mm x 102 mm
Chiller systemExternal; constant temperature setpoint over plate temperature range
Plate temperature controlPeltier system
Plate motionMotorized
Plate thermocouplesThree thermocouples on each plate, type K (two extra thermocouples with instrumentation kit)
Thermocouple resolution± 0.01°C
Number of setpointsUp to 99
Specimen sizes (max.)305 mm x 305 mm x 105 mm
Variable load/ contact force0 to 1930 N (21 kPa on 305 x 305 mm²) Force-controlled adjustment of the contact force or the desired thickness, and thus Density The mass density is defined as the ratio between mass and volume. density , of compressible materials
Thickness determinationAutomatic measurement of mean sample thickness Four-corner thickness determination via inclinometer Compliance to non-parallel specimen surfaces
Software featuresSmartMode (incl. AutoCalibration , report generation, data export, wizards, user methods, predefined user definable parameters, user-defined parameters, c p determination, etc.) Measurement History Report Enhanced Export Settings Storage and restoration of calibration and measurement files λ 90/90 Report Plot of plate/mean temperatures and thermal conductivity values Monitoring of heat flux transducer signal
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